Virtual L&L – How a Simple Solder Sphere Solves Today’s EMI Shielding Challenges

SnapShot® board level EMI shielding from XGR Technologies is truly a revolutionary approach to solving many of the short comings of traditional board level shielding solutions including inability to inspect and re-work, co-planarity, and penalizing board real estate requirements.

Join this Virtual Lunch & Learn session to see how it all starts with SnapShots unique attachment mechanism utilizing small diameter solder spheres.

This Virtual Lunch & Learn will be led by Bill Candy, Founder and President at XGR Technologies, and Jon Buchwald, VP of Sales and Marketing at XGR Technologies.

Aparna Sproelich, Technical Advisor/Principal at Aurora Group, will introduce Bill and Jon and will lead the Q&A session.

Register in advance for this meeting:
https://zoom.us/meeting/register/tJ0ucOGprz8uGNSz7gsUAVG9H-9ntOBXBeTb

After registering, you will receive a confirmation email containing information about joining the meeting.