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Virtual L&L – How a Simple Solder Sphere Solves Today’s EMI Shielding Challenges

January 27, 2021 @ 1:00 pm - 2:00 pm

SnapShot® board level EMI shielding from XGR Technologies is truly a revolutionary approach to solving many of the short comings of traditional board level shielding solutions including inability to inspect and re-work, co-planarity, and penalizing board real estate requirements.

Join this Virtual Lunch & Learn session to see how it all starts with SnapShots unique attachment mechanism utilizing small diameter solder spheres.

This Virtual Lunch & Learn will be led by Bill Candy, Founder and President at XGR Technologies, and Jon Buchwald, VP of Sales and Marketing at XGR Technologies.

Aparna Sproelich, Technical Advisor/Principal at Aurora Group, will introduce Bill and Jon and will lead the Q&A session.

Register in advance for this meeting:
https://zoom.us/meeting/register/tJ0ucOGprz8uGNSz7gsUAVG9H-9ntOBXBeTb

After registering, you will receive a confirmation email containing information about joining the meeting.

Details

Date:
January 27, 2021
Time:
1:00 pm - 2:00 pm
Website:
https://www.meetup.com/RIoT-NC/events/275604999/

Venue

Online event

Organizer

RIoT
View Organizer Website