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Virtual L&L – How a Simple Solder Sphere Solves Today’s EMI Shielding Challenges
January 27, 2021 @ 1:00 pm - 2:00 pm
SnapShot® board level EMI shielding from XGR Technologies is truly a revolutionary approach to solving many of the short comings of traditional board level shielding solutions including inability to inspect and re-work, co-planarity, and penalizing board real estate requirements.
Join this Virtual Lunch & Learn session to see how it all starts with SnapShots unique attachment mechanism utilizing small diameter solder spheres.
This Virtual Lunch & Learn will be led by Bill Candy, Founder and President at XGR Technologies, and Jon Buchwald, VP of Sales and Marketing at XGR Technologies.
Aparna Sproelich, Technical Advisor/Principal at Aurora Group, will introduce Bill and Jon and will lead the Q&A session.
Register in advance for this meeting:
After registering, you will receive a confirmation email containing information about joining the meeting.